Objective
Our goal is to develop high-performance microwave, millimeter-wave and submillimeter-wave packages and multi-chip modules in an organic platform that enables significant size, weight and cost reduction with increasing functionality. The major areas of our research include: 1) hermetic packaging, 2) multichip module and phased array antenna subsystems, 3) single packages and transitions, 4) millimeter-wave and submillimeter-wave transmission medium and interconnects.
Technology developed
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Low Cost Millimeter-wave Packages +Material
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Multichip module and phased array antenna subsystems +Material
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Low Cost Millimeter-wave Packages +Material
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Multichip module and phased array antenna subsystems +Material
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Low Cost Millimeter-wave Packages +Material
Related publications
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N. L. K. Nguyen, B. Nguyen, T. Omori, D. P. Nguyen, R. Moroney, S. D’Agostino, W. Kennan, and A. Pham, “A Wideband SiGe Power Amplifier Using Modified Triple Stacked-HBT Cell”, IEEE Microwave Wireless Components Letters, pp. 1-4, early access, DOI: 10.1109/LMWC.2020.3040352, January 2021.
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D. P. Nguyen, X. Tran, A. Pham, “A Wideband High Dynamic Range Triple-stacked FET Dual Shunt Distributed Analog Voltage Controlled Attenuator”, accepted for publications in IET Microwaves, Antennas & Propagation, December 2020.
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S. Wagner, B. Worthmann, and A. Pham, “Minimizing Timing Jitter’s Impact on Ground-Penetrating Radar Array Coupling Signals,” IEEE Transactions on Geoscience and Remote Sensing, pp. 1-8, early access.